BROOKS 4800 Series Elastomer Sealed Thermal Mass Flow Controllers & Meters
Ultra-fast response for time-critical flow processes.
Description
Ultra-fast response for time-critical flow processes.
Models 4850 / 4860
4850 | 4860 | |
Product Type | Mass Flow Controller | Mass Flow Meter |
Flow Range (Full Scale Capacity) | 50 sccm-40 slpm | 50 sccm-40 slpm |
Accuracy |
3.0% F.S.
1.0% F.S.(optional)
|
3.0% F.S.
1.0% F.S.(optional)
|
Repeatability | 0.15% F.S. | 0.15% F.S. |
Response Time | Normally Closed Valve: 300 ms-<1 sec | Normally Closed Valve: 300 ms-<1 sec |
Max Pressure | 150 psig/10 barg | 150 psig/10 barg |
Diagnostic Capability |
Status Lights: MFC Health, Network Status
Alarms: Sensor Output, Control Walve Output, Over Temperature,Power Surge/Sag, Network Interruption
Diagnostic/Service Port: RS485 via 2.5 mm jack
|
Status Lights: MFC Health, Network Status
Alarms: Sensor Output, Control Walve Output, Over Temperature,Power Surge/Sag, Network Interruption
Diagnostic/Service Port: RS485 via 2.5 mm jack
|
Analog Communication |
0-5 Vdc
4-20 mA
|
0-5 Vdc
4-20 mA
|
Digital Communication | RS232 | RS232 |
Features:
- Flow response time (settling time) of less than 0.75 seconds
- Innovative MEMS sensor and proprietary PID algorithm
- Compact size, less than half the size of typical thermal MFCs: 1″ x 3″ x 4″ (25 mm x 76 mm x 101 mm)
- Optional Local Operator Interface (LOI) simplifies set-up and operation, with a free LabVIEW VI download for monitoring and zeroing the device
- Digital capability via RS-232
Benefits:
- Well suited for a wide range of common, non-corrosive gases
- Fast response time ensures rapid steps during process recipe changes
- Excellent for OEMs: Compact size facilitates integration into tight machine spaces and speeds up installation
- Optional Local Operator Interface (LOI) provides a complete solution for local indication, set point control, and device configuration, eliminating the need for remote secondary electronics
- Variety of communication options available for easy alignment with user requirements
Applications:
- Heat treating, cutting/welding, and other thermal processes
- Solar/thin film physical vapor deposition (PVD) systems
- Analytical devices for measuring and controlling reagent, calibration, and sample gas flows