BROOKS GP200 Series Metal Sealed Pressure-based Mass Flow Controllers

All of the performance. None of the limitations.

Category:
Description
All of the performance. None of the limitations.

 

Performance
Repeatability <±0.15% S.P.
Response Time 280 + 20 ms Matched Transient Response, for any ascending or descending non-zero setpoint
Flow Range (Full Scale Capacity) 3 sccm – 50,000 sccm
Accuracy
Zero Leak Valve
<+1% S.P. (5-100% F.S.)
<+0.05% F. S.(0.5-5% F.S.)
Metal Seal Valve
<+1% S.P. (5-100% F.S.)
<+0.05% F S.(2-5% F.S.
Multi-Gas & Range Configurability MultiFlo tm Standard
Pressure Transient Insensitivity <+ 1% S.P, up to 40 psi/secinlet pressure spike
Control Range
Zero Leak Valve
0.5 – 100% F.S.
Metal Seal Valve
2-100% F.S.
Number of Bins
Nine (9) standard bin ranges
Flow Temperature Coefficient
Zero:0.005% FS.per°C
Span: 0.05% S.P. per°C
Zero Stability
<+0.15% F.S. per year
Mechanical
Wetted Materials
316L
Hastelloy C-22
316/316L Stainless Steel304 Stainless Steel
KM-45
PCTFE
Seal Material Metal
Level of Purity/ Surface Finish 5μ inch Ra avg
Valve Options
Normally Closed
Electrical
Analog communication
0-5 Vdc
Digital Communication
DeviceNetTm
EtherCAT®
RS-485 L-Protocol
Electrical Connection
Analog/RS-485 via 9-Pin “D” connector
DeviceNetrm via 5-Pin “M12” connector
EtherCATo via RJ45 jacks, Power via 5-pin M8 connector
Power Supply/Consumption
Analog/RS-485 L Protocol: 6 Watts max @ +15 Vdc (+10%) or +24 Vdc(+10%)
DeviceNetrm:545 mA max @ +11-25 Vdc, 250 mA max @ 24 VdcEtherCATTm:360 mA max @+18-30 Vdc, 270 mA max @ 24 Vdc(Under typical operating conditions)
Diagnostics & Display
Diagnostic Capability
DeviceNet
MFC Health
Network Status
EtherCAT
Run
Error
Power
Network Status
RS-485 (analog)
Network Status
Alarms
Process Control Deviations
Flow
Temperature
*For full list of alarms see supplemental communication manuals
Diagnostic/Service Port RS-485 via micro-USB
Display
Top Mount integrated LCD
Viewing Angle: Rotatable
Viewing Distance: 10 feet
Units Displayed: Flow (%), Temp (°C), Pressure (psia, kPa)
Resolution: 0.1 (unit)
Ratings
Max Temperature 60°C
Max Pressure
150 psia
Differential Pressure Range
Min: 7 psid
Max: up to 50 psid
Compliance
EMC 2014/30/EU EMC Directive EN:61326-1:2013
Environmental Compliance
2011/65/EU&2015/863/EU RoHS Directive
EC 1907/2006 REACH Directive

Features:

  • True differential pressure measurement
  • Lower inlet pressure operation capability
  • Downstream valve architecture
  • Matched transient response
  • Zero Leak-by Control Valve
  • MultiFloTM technology allows for flexible programming of gas and flow range configurations without removing the MFC from the gas line or compromising accuracy
  • Local display indicates flow, temperature, pressure, and network address
  • DeviceNetTM, EtherCAT®, RS-485 L-Protocol, and analog interfaces

Benefits:

  • GP200 differential pressure technology reduces measurement uncertainty, enhancing accuracy, repeatability, and drift performance by eliminating the need to match and compensate two separate pressure transducers.
  • Safer operation at lower inlet pressures possible with a P-MFC using the optimized GP200 differential pressure sensor for low differential pressure measurement.
  • Accuracy remains independent of downstream pressure due to the downstream valve architecture, enabling flow delivery into pressures as high as 1200 Torr. The fast closing valve addresses non-productive recipe wait times and mitigates “tail effects” seen in upstream MFC valve designs that require additional time to bleed down their internal gas volume.
  • Ultra-fast and highly repeatable ascending and descending flow stabilization time allows for tighter process control in advanced high-cycle Deposition and Etch processes.
  • 100X improvement in valve shut-down capability.
  • MultiFloTM enables re-scaling of MFC full-scale flow range down by a factor of 3:1 without impacting accuracy, turndown, or leak-by specifications, providing process and inventory flexibility.
  • Convenient user display and independent diagnostic/service port facilitate device installation, monitoring, and troubleshooting.

Key Applications:

  • Semiconductor manufacturing
  • Etch processes
  • Chemical Vapor Deposition (CVD)
  • Gas flow control applications that require a high-purity all-metal flow path

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