BROOKS GP200 Series Metal Sealed Pressure-based Mass Flow Controllers
All of the performance. None of the limitations.
Description
All of the performance. None of the limitations.
Performance | |
Repeatability | <±0.15% S.P. |
Response Time | 280 + 20 ms Matched Transient Response, for any ascending or descending non-zero setpoint |
Flow Range (Full Scale Capacity) | 3 sccm – 50,000 sccm |
Accuracy |
Zero Leak Valve
<+1% S.P. (5-100% F.S.)
<+0.05% F. S.(0.5-5% F.S.)
Metal Seal Valve
<+1% S.P. (5-100% F.S.)
<+0.05% F S.(2-5% F.S.
|
Multi-Gas & Range Configurability | MultiFlo tm Standard |
Pressure Transient Insensitivity | <+ 1% S.P, up to 40 psi/secinlet pressure spike |
Control Range |
Zero Leak Valve
0.5 – 100% F.S.
Metal Seal Valve
2-100% F.S.
|
Number of Bins |
Nine (9) standard bin ranges
|
Flow Temperature Coefficient |
Zero:0.005% FS.per°C
Span: 0.05% S.P. per°C
|
Zero Stability |
<+0.15% F.S. per year
|
Mechanical | |
Wetted Materials |
316L
Hastelloy C-22
316/316L Stainless Steel304 Stainless Steel
KM-45
PCTFE
|
Seal Material | Metal |
Level of Purity/ Surface Finish | 5μ inch Ra avg |
Valve Options |
Normally Closed
|
Electrical | |
Analog communication |
0-5 Vdc
|
Digital Communication |
DeviceNetTm
EtherCAT®
RS-485 L-Protocol
|
Electrical Connection |
Analog/RS-485 via 9-Pin “D” connector
DeviceNetrm via 5-Pin “M12” connector
EtherCATo via RJ45 jacks, Power via 5-pin M8 connector
|
Power Supply/Consumption |
Analog/RS-485 L Protocol: 6 Watts max @ +15 Vdc (+10%) or +24 Vdc(+10%)
DeviceNetrm:545 mA max @ +11-25 Vdc, 250 mA max @ 24 VdcEtherCATTm:360 mA max @+18-30 Vdc, 270 mA max @ 24 Vdc(Under typical operating conditions)
|
Diagnostics & Display | |
Diagnostic Capability |
DeviceNet
MFC Health
Network Status
EtherCAT
Run
Error
Power
Network Status
RS-485 (analog)
Network Status
|
Alarms |
Process Control Deviations
Flow
Temperature
*For full list of alarms see supplemental communication manuals
|
Diagnostic/Service Port | RS-485 via micro-USB |
Display |
Top Mount integrated LCD
Viewing Angle: Rotatable
Viewing Distance: 10 feet
Units Displayed: Flow (%), Temp (°C), Pressure (psia, kPa)
Resolution: 0.1 (unit)
|
Ratings | |
Max Temperature | 60°C |
Max Pressure |
150 psia
|
Differential Pressure Range |
Min: 7 psid
Max: up to 50 psid
|
Compliance | |
EMC | 2014/30/EU EMC Directive EN:61326-1:2013 |
Environmental Compliance |
2011/65/EU&2015/863/EU RoHS Directive
EC 1907/2006 REACH Directive
|
Features:
- True differential pressure measurement
- Lower inlet pressure operation capability
- Downstream valve architecture
- Matched transient response
- Zero Leak-by Control Valve
- MultiFloTM technology allows for flexible programming of gas and flow range configurations without removing the MFC from the gas line or compromising accuracy
- Local display indicates flow, temperature, pressure, and network address
- DeviceNetTM, EtherCAT®, RS-485 L-Protocol, and analog interfaces
Benefits:
- GP200 differential pressure technology reduces measurement uncertainty, enhancing accuracy, repeatability, and drift performance by eliminating the need to match and compensate two separate pressure transducers.
- Safer operation at lower inlet pressures possible with a P-MFC using the optimized GP200 differential pressure sensor for low differential pressure measurement.
- Accuracy remains independent of downstream pressure due to the downstream valve architecture, enabling flow delivery into pressures as high as 1200 Torr. The fast closing valve addresses non-productive recipe wait times and mitigates “tail effects” seen in upstream MFC valve designs that require additional time to bleed down their internal gas volume.
- Ultra-fast and highly repeatable ascending and descending flow stabilization time allows for tighter process control in advanced high-cycle Deposition and Etch processes.
- 100X improvement in valve shut-down capability.
- MultiFloTM enables re-scaling of MFC full-scale flow range down by a factor of 3:1 without impacting accuracy, turndown, or leak-by specifications, providing process and inventory flexibility.
- Convenient user display and independent diagnostic/service port facilitate device installation, monitoring, and troubleshooting.
Key Applications:
- Semiconductor manufacturing
- Etch processes
- Chemical Vapor Deposition (CVD)
- Gas flow control applications that require a high-purity all-metal flow path